Zero ASIC is out of stealth
zeroasic.com
zeroasic.com
One question that immediately comes to mind is if there are a few pins on the interposer that are basically pass-through to the 2 x 2 mm chiplet on top, so that a chiplet that provides some level of I/O beyond what the interposer already has can be supported. I assume the UCIe links or something can be used as generic high speed SERDESes for that sort of use case, but more thinking about radar FEs and such.
IIUC fiber transceivers have become better than baseband copper differential pair transceivers for same-rack cluster interconnects.
And the main issue with them is packaging difficulty/needing to have a cheap link to the switching fabric data plane, if these benefits are to remain strong after accounting for the overhead that result from not being able to integrate the PHY on the same die as the fabric data plane. Both efficiency and cost.
I tried to find a use for the Epiphany cores, but the speeds and feeds were too unbalanced for anything I was looking at at the time.
The way that particular story played out suggests that I wasn't alone.
* 2008 was a really bad time to launch a chip startup
* Epiphany predated RISC-V...nobody wants a new ISA
* With <$7M raised in 9 years it was starved, there was no way to turn architeture into a good market fit (this would have required $50-$100M in tapeouts, CPU licensing, IO licensing, sw,sw,sw,,,). This is the problem we are trying to address now.
Epiphany did find some customer end applications (machine vision for example) and the Parallella board shipped in volume. The volumes and number of customers just wasn't big enough. Everybody wants to be the next ARM, Nvidia, but there is only room for 1-2 on earth.
I hope these guys have some ASIC modules for interfacing with CMOS global shutter sensors. Damn if they did I might start a machine vision cam company myself
Right now y'all look focused on digital logic somewhere between ASICs and FPGAs.
Any plans for custom chiplets? Custom analog layout might be much cheaper if done MPW or Tiny Tapeout style: design a mere ~100x100um area, then bond it to standardized chiplets for control/power.
The Zero ASIC platform does "late binding" by wiring together different chiplets (cpu, lm, fpga, serdes,...) in the package. Both approaches are addressing the same problem of flexibility vs performance, but the approaches are very different.
I get that you want to generate leads, but giving the least trustworthy social network as there only login option to save 2 seconds pasting a name into the LinkedIn search box isn't a good idea. Many of us are forced to use LinkedIn for career reasons, but try to keep it isolated from everything else, because we remember when it scanned people's contacts without permission and other dodgy behaviour.
Yes!
I didn't realise you were giving time away on FPGAs. Probably the best option would be to have a lighter preview that just shows the UX but not simulation, for anonymous users.
Unless you really expect your business to be mostly high-touch sales, giving your potential customers as much information as possible before you demand anything from them is probably the best strategy
Almost everyone used LinkedIn, and of course the profiles were so much more helpful, so we simplified our process and used LinkedIn only. We never had any issue with that, its a great choice
https://www.digikey.com/en/products/detail/amd/XCVM1802-1MSE...
As a comparison, this fully-built PCIe card with a VU13P FPGA costs $13k at quantity 1: https://www.mouser.com/ProductDetail/BittWare/XUPVV8-0007?qs...
While a single unit of a comparable chip to the one on that card costs $77k on digikey: https://www.digikey.com/en/products/detail/amd/XCVU13P-2FHGC...
The Bittware CVP-13/XUPVVP product was $5100 new.
Used VU13Ps run $300 in China.
The manycore emulation demo kind of hints at where we are going...more information to follow in the next few months.
Having small IP cores where the source can be verified/audited that can then be snapped together like Lego blocks are very appealing from both a cost savings and supply chain safety standpoint.
I help run FPGAjobs.com and we’ve helped hire folks with that skillset into companies like ZeroASIC.
We could almost certainly help you fill roles like these:
https://www.zeroasic.com/careers/digital-ic-designer
https://www.zeroasic.com/careers/senior-verification-enginee...
Drop us a line at fpga.RTL.jobs@gmail.com if that’s of interest!
And another question: The quad core RISC-V chiplet, is that 64 bit? RV64GC? Any other extensions like V, H, ...?
The RISC-V chiplet a standard RV64GC. The high level spec is at: https://www.zeroasic.com/docs/cpu
I guess the main benefit of the chiplet idea is that you can get a really fast, low-latency connection between the CPU and FPGA? What kinds of problems can be solved with that architecture, that can't be solved by just putting the CPU and FPGA as separate chips on the same circuit board?
Or is it cost and design simplicity, you can have a lot of chiplet elements on the same chip, and the customization is in which chiplets you want ("give me a chip with 4xFPGA and 6xCPU") and how they're connected ("CPU A should be connected to FPGA #4, CPU B should be connected to FPGA #2 and #3")?
Also...there is way too much emphasis on compute, most applications are IO/ memory bound. How many memory/serdes channels, total I/O BW, on chip cache sises, what type of I/O is much more important than peak theoretical flops/w.
That said, that kind of flow has people who love it.
The name collision is a bit annoying.
Can someone explain in simple terms what's the added value, compared to buying an FPGA with an embedded RISC-V core? Like, if you want maximum configurability, you already have FPGAs, and if you want maximum performance, you have ICs. Where does Zero ASIC come in? How does it push the Pareto frontier? Is it for prototyping or for final products?
If none of the off the shelf components can meet the application cost, power, performance, size, weight, security constraints, you have the choice of either abandoning the project or spending $10M-100M to design an ASIC. Our chiplet approach fills the gap between ASICs and off the shelf FPGAs.
Like, say I'm in a startup working on a novel microcontroller, or a novel ASIC, or a chip for a space rocket. Right now I'm prototyping on an FPGA, but performance / power / weight isn't good enough. Where does your product come in?
Like, if I'm not getting enough performance-per-power from an FPGA, how am I going to get enough from your eFabric chiplets? The underlying computation still happens on FPGAs and RISC-Vs, right?
Or is that you can embed your own custom circuits between pre-made chiplets? In that case, how do you save on capital costs (eg making the mask)? Through a fab shuttle?
case #1. If you truly have something custom IP, we could save time/effort by only chipletizing that part rather than working on the while SoC. The design and verification is an exponential function with respect to complexity(#blocks, die size). We can turn RTL into a 2mm x 2mm brick fairly easily.It would require a fab shuttle/mask sets though.
case #2. Depends on huw much power goes to the PL vs other functions. For PL dominated FPGAs that you fill up to the brim, our only value would be to help like in case #1. For multi chip solutions (FPGA + CPU) with small amounts of PL, a corretly designed small catalog of off the shelf chiplet approach wins.
a) There is a huge fixed cost to developing a chip
b) a start-up can usually only afford to develop one innovative block. They must then obtain the right to use many off the shelf IP blocks (CPU, interface blocks, radios) to make a complete chip product. The economics of this mean that large semiconductor companies, who have a large portfolio of blocks that they don't need to pay licence fees for, are at a huge advantage
c) As chip products have integrated more and more features on a single die, these factors have become more and more dominant
For these reasons, for some time now aquisition by a big player has been the only realistic 'exit' available to startup founders in the semiconductor area.
In theory, Zero Asic's approach could mitigate all of these, which would lead to a much more active chip startup scene.
OAuthZeroASIC would like to: Use your name and photo
How are they going to use my name and photo?
AI generated erotic visuals also cant create Section 230 liability, compared to humans
ripe
https://www.dogonews.com/2023/9/25/adidas-super-shoes-help-t...
The main pitfall while doing that, is abusing the preprocessor, because writting "c++" using a preprocessor assembly is hardly less worse than coding c++ then creating a absurdely massive and complex SDK dependency.