[1] https://en.wikipedia.org/wiki/Restriction_of_Hazardous_Subst...
[1] https://en.wikipedia.org/wiki/Restriction_of_Hazardous_Subst...
It's horrid to use. And the lead-free stuff is far worse in manufactured equipment - how many devices have failed early due to BGA solder joint failures that basically didn't exist before RoHS requirements? I think the nVidia 8600M issues were traced to that, and plenty of other BGA equipment since 2006 or so has failed rather early.
I use Chipquik SAC305 with water-washable no-clean flux core and I actually prefer working with it over Sn63Pb37.
My lead-free joints come out nicely rounded and shiny just like my leaded ones with some practice and the right consumables. But I certainly have to break out hot air station more than I would when using leaded solder to deal with larger thermal masses (and why I will still break out my spool of leaded wire on rare occasion when I'm working with temp-sensitive components and just want it on the freaking board).