A key architectural feature to achieve this is the ability to fit all model parameters inside the on-chip SRAMs of the chiplets to eliminate bandwidth limitations. Doing so is non-trivial as the amount of memory required is very large and growing for modern LLMs
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On-chip memories such as SRAM have better read latency and read/write energy than external memories such as DDR or HBM but require more silicon per bit. We show this design choice wins in the competition of TCO per performance for serving large generative language models but requires careful consideration with respect to the chiplet die size, chiplet memory capacity and total number of chiplets to balance the fabrication cost and model performance (Sec.3.2.2) We observe that the inter-chiplet communication issues can be effectively mitigated through proper software-hardware co- design leveraging mapping strategies such as tensor and pipeline model parallelism