Ok. You know, exists different maps. One type of maps called many islands. On island map many things possible to do only on terrain (island), and some things just impossible to do on water.
In semiconductors, mono-crystal is like islands - it have perfect parts, and have defects, where 10nm will not work at all.
People spent lot of time to figure out, what to do with defects, but complete solution for all cases does not exist.
Most know solutions, to make modular structure, so parts appear under defects will just disabled by seals (cut by laser).
For example, Intel large die could be with 8 cores, but 2-4 will be disabled after testing, and than will marketed 3 types of CPUs - 4,6 cores (they don't like odd numbers, but I know well, marketed 3-cores CPUs).
Other solution, to make few Cache parts considering some disable.
RAM/Flash chips nearly all now typically made modular, so they have for example 6 parts in design, but marketed chip will have 2-4 working parts.
Latest idea, most successfully used by AMD, to use chiplets - they use two (or more) technologies.
From first view could consider chiplet as one core or even one part of chip - Cache or HBM or even Flash.
As interposer (base) used something like old 45nm (more tolerate for defects) and on it placed one or more 10nm or better chiplets, connected with TSVs (Throw-Silicon-Via).
Chiplets could be placed side-by-side or one on other (I hear about 8-level chips, but sure, for heat consideration in AMD CPU/APU used 2-level design).
Interposer could be passive (just pads/wires) or active (some silicone elements or even logic/analog modules).
Also exists just classical interposer printed boards, but they are very limited.
What I want say, performance of your chip will depend, on how well it suited for anti-defects tricks, such as modular design and/or chiplets design.
Unfortunately, silicon interposer technology is very young and not mature, just few months ago appear first industry standard, and just now conducted r&d on Open Source interposer tech.
So there are not much to read, but silicon interposer will affect all new designs in very dramatic way.
As for me, most revolutionary example, joint venture design, Intel CPU with AMD chiplet GPU (Core i7-8809G with Radeon RX Vega M GH graphics ).