Intel already launched a processor with 16GB on-package MCDRAM in 2016 (Knight's Landing Xeon Phi). You can even buy an Intel Xeon with 64GB HBM2 today. Nvidia likewise has been packaging HBM with their server GPUs.
Embedded DRAM (eDRAM) been used for long time in the mobile and console space. e.g. IBM's POWER7 (e.g. Nintendo Gamecube) and Intel Haswell products. However, using a logic process node to make DRAM cells is wasteful. Packaging technologies have advanced sufficiently that you now regularly see regular DRAM dies (LPDDR, HBM) being put on-package.
But all of that is packaging and manufacturing technologies. We're still taking to DRAM over a memory bus like we're still living in the '80s. The true innovation I'm looking out for is for a company to stick its neck out and use a different communication standard to talk with the DRAM modules. Something like the CLX.mem standard, which is used in the server space to talk to memory expansion modules.