TSMC has been badgering their customers to move to 28nm for the past year. They've even been building out more 193nm capacity usable down to N12 because they can do it without waiting on ASML (Nikon can provide 193nm immersion lithography equipment) since ASML is where all the EUV advanced node supply chain holdup actually is. For everything that's not EUV probably 2024 is when wafer starts stop being insane.
The rest of us waiting for high end processes to expand in availability and drop in price? ASML basically has an infinite waitlist at this point.