I'd like to think that as NAND continues to scale up in capacity and lower in cost, that we'll see some real shakeup to filesystems and storage where self-healing mass storage can be genuinely commoditized -- not something that's only accessible to businesses (and computing enthusiasts) due to cost and complexity.
My hope as we move into more advanced fabrication nodes is the increasing shift to HBM in the data center space starts to at least create an HBM option in the consumer side of things. I expect at least AMD to try that push in 2027 and beyond, and I’m sure Intel is looking hard at it too. Granted, Apple is already there with its higher end silicon.
Granted, I still expect there to be product line segmentation with ECC, as it’s a good lever to push a buyer into a higher end product. Though when it’s done on package, you at least eliminate the need for a main board to actually have the traces, and the external modules to have the extra memory. So it might be the easier route to get to more ECC in the consumer space, at least for mid-range and up personal computers.
Once I coded a shell script that verified all my photos, but I don’t bother with that anymore. I just back everything up, and if there’s ever a problem, the parity files provide an additional safety net.