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They won't manufacture something secondary such as a modem on cutting edge super expensive silicon.

Pretty sure I've read on Macrumors that they are developing their modem on TSMC 6nm.

I'm surprised that they aren't trying to integrated it into the CPU like Qualcomm does with the Snapdragon processors.

The thermals on that would be difficult to deal with I think. Snapdragon had thermal problems for a long time. Have they solved it? What did they end up doing?

> I'm surprised that they aren't trying to integrated it into the CPU like Qualcomm does with the Snapdragon processors.

Sometimes it's not worth the hit to yield to put it on die. On package might be a better tradeoff.

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