>If a vendor doesn't work out, just move to another RISC-V vendor.

It doesn't really work that way. NASA needs two main things that most vendors can't supply: a radiation-hardened chip, and super-high quality controls. Implementing on an FPGA is much slower than an ASIC, but the ESA did it with the LEON3 processor.

Radiation hardening can come in a variety of ways, from redundant designs (3-core voting, EDAC) to manufacturing processes (silicon-on-insulator, gate structures) to even packaging (high density ceramic). These have very little overlap with commercial applications, so the vendor choice is still very limited.