Yes, but if you do have to design a PCB for soldering wires to pads, you can increase the strength of the pad by making the pad much larger in the copper layer. You can still keep it the original smaller size in the solder resist layer; keeping the soldering area away from the pad edge and fragile traces there increases the strength further, and gives it a tidy look and a nice soldering experience.

For quick one offs, simply place a normal pad, place a copper fill polygon connected to the same net around the pad, and turn off thermal reliefs / set pad connection to solid for the polygon. Obviously if you need it a lot, draw a new footprint.