One thing that should be mentioned is that a lot of 200 mm production is moving to 300 mm. On Semi are probably the poster child for this with their new 300 mm fab in Fishkill, new york (acquired from global foundries) intended to take over production from a lot of small 200 mm fabs. There is also texas instruments that is building several new 300 mm fabs where they will build products that were previously made on 200 mm.

However, moving from 200 mm to 300 mm requires a total redesign and for some chips the redesign is not worth it. There are other differences between 200 and 300 mm than just the size of the wafer.

Regardless, the industry is trying to move everything they can to 300 mm, and hopefully will thus leave some space for the remaining 200 mm devices to grow.