No, the errors are inside the feature itself, since it doesn't fit on a single mask. You can't reuse design files on a new process. Everything will be wrong. You have different material properties, different gate capacitances, different parasitics. No matter what you do, you have to redesign to move to a new node. The problem with large features is, even if you do all that work, you still can't reliably make them with the smaller process, and all the benefits of the smaller process (smaller die size, faster switching, higher speeds, shorter interconnects) go away if you use large features.