[edit: the answer is yes]
[edit: the answer is yes]
The pendulum from just sourcing from companies like Bosch, Continental turned hard about five years ago. Now electronic and SW design is critical diversification, and part of what creates core value in automotive.
On the other hand if car companies would buy the few remaining components for electrical vehicles from subcontractors… well, all the cars and brands would be exactly the same with minor adjustments.
Now it is 100% in the other direction. There are engineers everywhere. Basically, if there is a space (under stairs even), there is a desk with an engineer. Doing serious design work. The new automotive cybersecurity requirements also contribute to renewed need for control and detailed knowledge of subsystems.
It is also the part that sucks most from a consumer's point of view. As a consumer, I want choice, not lock-in by the manufacturer after I buy a car.
If they are based on open protocols, standards, provide API, is released as open source could happen in either of those two scenarios. I know manufacturers that use, promote and contribute to open source and standards. Do you think the big automotive suppliers are better or worse in this regard?
Also, choice here is kind of fuzzy. Choice in car brand and model? Choice in apps running in the enterrainment system? Choice in what SW is being executed by one or more of all the hundreds of CPUs, MCUs, GPUs, NPUs in the car?
It's the things like power management ICs, that have to deal with much larger currents and voltages, that are problematic, and you can't respin those on smaller node, and that's before you go for automotive grade tolerances.
That new MCU with new safety certification (and there's a lot of those going on, even a layman like me can see a push for equivalent of Integrated Modular Avionic in automotive) is going nowhere if it can't get power.
28nm by today's standard is already a very old tech. maybe the car vendors should move up
- Would require a redesign.
- Certain parts of the die cannot be shrunk: bond pads, esd protection, output drive transistors.
- Certain parts of chips are designed for proprietary processes (eFLASH, analog)