Intel has had a number of embarrassing technology misses that have put them behind: the first I remember was through-silicon vias for 3D stacking and it was only a matter of time before they missed something necessary for an advanced fab, and they missed on EUV.
Their foundry engineers at the same time were recruiting more engineers out of school on the basis that they were the "best in the world." They thought their position was unassailable because they had high yield at 22 nm, so they rested on their laurels and missed technology after technology before it bit them.