Next-gen chips will be powered from below
spectrum.ieee.org
spectrum.ieee.org
One aspect that I've pondered that would save power would be having the memory closer to the CPU and all that usable real-estate for slots upon the reverse of the motherboard. Sure you would be looking at new case designs in a way or existing ones with new design considerations upon the mounting plate to have gaps to accommodate sockets upon the reverse of the motherboard PCB. That without having to compete with the CPU airspace for cooling and in effect using the motherboard to zone things, could work out well.
You CPU, or 9 out of 10 recent phone/tablet SoCs are all upside down chips.
https://en.m.wikipedia.org/wiki/Flip_chip
So, it's actually going to be an improvement from the thermals side, especially with TSVs carrying heat from the other side to the heatsink.
Heatspreader
TIM
Silicon
Silicon
Silicon
Silicon
Silicon
Silicon
Silicon
Silicon
Silicon
Active layer
Metal layers
Metal layers
Passivation
Solder bumps and glue
Solder bumps and glue
Solder bumps and glue
Solder bumps and glue
Substrate/interposer/PCB
What this article proposes is to put metal layers on BOTH sides of the active layer, so you get more metal closer to it. That's what they mean by "powered from below". If you look at a chip today, they're all "powered from below" in the sense that the metal layers are "below" the active layer and power (and all signals) are fed in from "below" through the interposer.This feels out of place coming from IEEE.
If someone can build a fridge that is so efficient, it can make do with 6A @ 2V, dang. Where can I buy me one of those? That's 12W total, I can power one of these for a full hour with 4 AA batteries.
To understand what they're saying, you need to understand current as distinct from power regardless of the scale. If you do understand this distinction, but you don't have a feel for what 100 amps is, perhaps a good comparison is starting a car.
You say that like it's obvious. I don't see why.
In my electrical engineering classes, we use amps to determine the gauge of wires.
The important calculation here is watts = I^2 * R
Where R is the resistance of your wire, and watts is the power wasted in your wires.
And I is amps. That little squared sign is a bit intimidating. Under normal circumstances, you want to increase voltage to reduce wire loss. But computer chips only operate at low voltage.
It's possible to fill them up with goo that has a much higher dielectric breakdown than air, so I don't believe this is the reason
Watts are a function of Volts * Amps. So them talking about a fridge using 6 amps at 120 volts is really quite a silly comparison to using 200 amps at 1 volt. The fridge is using 720 watts of power compared to 200 watts from the chip.
In no way is it like having three fridges in your pocket.
High voltages are good when you want to deliver power because that is what you need (motor HP, space heater, etc.). But we don't use an IC for power, we use it to do logic, and in that case, logic is just much more efficient at low voltages.
It's amazing how well Asimov's robot stories have aged in these A.I. times.
In the case of a CPU, higher voltages don't work with the semiconductors, so they have no choice but to use high amperes, and that becomes a problem.
That's 12watts. You just need some great insulation and enough time. If you are willing to never open the door and can wait days for your beer to chill, a 12-watt fridge is very doable.
The wires in the refrigerator would likely be unable to handle 20A at 2V.
Amperage determines the wire diameter. High amperage means very wide wires.
I think their point is that this is what ultimately drives the need to power from below.
Sure, _we_ know the difference between amps, watts, and watt-hours, because we paid attention in science class, but most people still get them mixed up.
It's the IEEE. It's not designed for average consumption. That's almost OP's point, which make this counterpoint a bit comical.
It being on IEEE, I can't imagine anybody on their target audience will be confused and imagine they are talking about power.
Generally, not all the transistors in your chip switch. The transistors that don't switch provide a charge reservoir to draw from for the transistors that do.
The problem is then backfilling all that current that got lost and you have to do that within one clock cycle--which is the "lots of current" that this article is talking about.
Because you have these pulses of current snapping from on to off at fairly high frequencies being fed over long distances with very little resistance to damp them, inductance kicks in and starts causing oscillations (LC tank).
However, at this point Moore's Law about performance is dead (2x every 18 months), so this is not a very big deal.
Moore's Law about cost is still alive (double the number of transistors/halve the cost every 18 months). So, the big deal currently is in the embedded space where leakage is more problematic because the die is mostly determined by RAM and flash sizes which goes directly to current leakage and die size.
I would have thought that the actual power distribution is done some other way. How does this 200A actually work in practice? Do they start with higher voltage and step down? This poor analogy means I don’t understand the problem that’s been solved.
I would really have liked to learn this from the article, but instead all I can think of is the one noisy compressor in my 20yo fridge sucking down 6A (probably 3A where I live) over cables almost as thick as a CPU is wide.
As you might have noticed, these power-hungry chips have a large number of pins, and quite a lot of them are dedicated to power, exactly to avoid having a single pin having to carry 200 amps.
Here's[1] the pinout of the AM4 socket, where the pink and green squares represents power and ground respectively. As you can see they make up almost half of the pins.
The motherboard is primarily supplied by 12V these days, which is then converted down to the 1-2V needed using multi-phase buck converters[2]. If you've ever seen motherboards boasting some number of VRM phases, this is what they're talking about. Gamers Nexus has an overview[3] of this as well.
The problem they're talking about is similar to the AM4 socket. You have a bunch of signal pins, and they're connected to output transistors inside the package. You'd like to avoid long connections, so ideally the pin is close to the relevant output transistors on the chip.
However you also got all this power that needs to be supplied, and you gotta spread that out over multiple pins. So it's a challenge to best arrange the power vs signal pins, minimizing the detours either have to take. Long connections means higher inductance and resistance, which is a problem for both signal and power.
Imagine instead the CPU was mounted like a sandwich, with pins on both sides. Then it would be easy, as you could just place all the power pins on one side and signal pins on the other side.
This is the solution they propose, except on the chip level.
[1]: https://www.docdroid.net/6cDW11N/am4-pinout-diagram-pdf
[2]: https://en.wikipedia.org/wiki/Buck_converter#Multiphase_buck
[3]: https://www.gamersnexus.net/guides/1229-anatomy-of-a-motherb...
So would I be right to say that the problem is that the way power is delivered to individual transistors is getting too complex while the features are getting too small? The article started out by focussing on the total current at transistor voltages, but at 12 volts to the chip it’s just ~16 amps (still a lot!), spread across say 100 pins = 160mA per pin. Which isn’t as impressive as 200A. 200A is clearly not a wire you see going into a CPU.
It’s a shame that the article seems to have chosen to oversimplify the problem at the expense of helping us understand. The complexity of power delivery from the top of the chip looks fascinating, but it lost me at the outset with claims that wouldn’t pass muster with a high school electronics enthusiast.
It's the chip itself that needs 1-2V, so the buck converter is on the motherboard. So indeed 200A enters the chip. The linked GN article has a nice overview of the motherboard VRM layout.
The AM4 socket has 1331 pins though, so with roughly a quarter of those sourcing current that's 0.6A per pin (the other half of the power pins sinks that current).
Maybe not great.
Within 10 means an idea with simulation. Within 5 means prototyped. Interesting means never. Or that, at least, is my decoder ring.
Bit misleading, there. A != W
W is watt ("Watt" -geddit?) cooks your junk, if the phone has a heat issue.
Used to be an EE, back in the Dawn Times...
Of course, all of those are relevant, but the one number that sizes the thing is current.
First, metrics. When you click the button, they get a signal that someone has been reading the page.
Secondly, there are a lot of JS APIs that require human interaction before you're allowed to use them, for privacy reasons. By clicking a button, those are "unlocked" and they can send all your privacy-obliterating data back along with their metrics.
That's how :(
The publishers want money, just to pay their bills.
Or a specific search term for this interaction requirement phenomenon? I tried the obvious searches, but got lots of false positives in the results.
I am asking as a non-web developer who cannot resist rubbernecking at the incredible dumpster-fire-on-a-trainwreck that is web privacy.
It changes radically between browsers, and browser versions, even before you get to user settings in those browsers that can change it further.
Pro-tip: you can probably block these tracking JS APIs by disabling JS, using NextDNS, setting up a Pi-Hole, or usinf uBlock Origin.
Power fed vertically. Not sure it's BPR specifically, but they do mention ~50% efficiency improvement in the PDN so it's comparable.
That's quite a gross inaccuracy coming from the ARM researchers.
Most chips barely get above 100W/cm², and it's a very hard limit.
https://www.acs.org/content/acs/en/climatescience/energybala...
Were you perhaps thinking of the intensity of sunlight reaching the top of Earth's atmosphere?