This is real, shipping technology.
See 3d nand flash cells, see stacked cache and HBM memory. All the usual characters are working on it. Intel, AMD (TSMC), Samsung.
Cooling is an issue, but there are solutions.
See 3d nand flash cells, see stacked cache and HBM memory. All the usual characters are working on it. Intel, AMD (TSMC), Samsung.
Cooling is an issue, but there are solutions.
There's a reason memory can generally beat computational cores to smaller node sizes. It's because highly uniform circuits are much easier to manufacture. A lot of problems present in CPU logic cores (such as cross talk) just aren't present to the same extent in NAND cells.
It may be a simple typing problem, but Wikipedia doesn't seem to have it.