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I'm more impressed by the cavity PCB construction--fill with epoxy and boom dead simple waterproofing! I've never encountered this before; wonder if it's available with the batch fabs.

Pretty common in ruggedized devices. Has the benefit of keeping components stuck down under vibration and tamper evident too.

The technique is called "potting", and is common for small rugged devices. I think nearly all assembly houses will offer it. Some electronics components, such as relays, power converter modules also use it.

The difficult part is the step milling for the cavity. Its unusual so you need to work with the fab to get it right. Bunny Huang had a good post about it.

USB remains the only connector I use where I routinely get the orientation wrong 3 times.

This is a good discussion of how it works: https://electronics.stackexchange.com/questions/209941/two-s...