We know that some components of a chip benefit more from die shrinkage than others. Intel is having yield problems with die shrinkage. Chiplets are a thing.

I can’t for the life of me figure out why Intel hasn’t already hedged their bets and started working hard on hybrid chips. Especially since this now appears to be a long term industry direction. If the next step blunts the consequences of your current problems, why not jump on it?

Sunk cost fallacy?