I am assuming that the radial layout of the SSDs (which are hard soldered btw, so not user replaceable/upgradable like past models) and the RAM, must be for cooling purposes as well.
Overall the PCB is not very condense. Everything is quite spread out on it... again I assume for cooling. It looks like cooling is either a major concern for this device, or that Sony over-engineered its cooling in order to prevent problems.
(Edit: oh in my off the cuff estimation, I am also attributing the empty space in the case to cooling as well, since that is an intentional design choice by Sony and contributes to its airflow capability and cooling capability).