per the article:

-SMIC is shipping 14nm finFETs, with a 7nm-like process in R&D. -Yangtze Memory Technologies (YMTC) recently entered the 3D NAND market with a 64-layer device. A 128-layer technology is in R&D. -ChangXin Memory Technology (CXMT) is shipping its first product, a 19nm DRAM line. -China is expanding into compound semis, including gallium nitride (GaN) and silicon carbide (SiC). -China’s OSATs are developing more advanced packages.