A chip that size, imagine the yield. Equally, cooling - has to be water based as a heatsink that size would be on par to a small anvil and the weight factor would be some serious issues. Though unsure as no pictures of it in-play alas and all they say is - "20 kilowatts being consumed by each blew out into the Silicon Valley streets through a hole cut into the wall", which does somewhat beg for a picture as just raises more questions.

Why would they make a chip this big with AMD showing a chiplet design approach is cheaper and more scalable on so many levels. Let alone, yields.

Equally, arms approach to utilising the back of the chip as a power delivery :- https://spectrum.ieee.org/nanoclast/semiconductors/design/ar...

Then a wafer scale chip like this, using that approach, would save so much power. But again, yeilds will be a factor and can imagine this is not the cutting edge process node as you find as nodes mature, the yields improve. So an older node size would have a better yield and be more suitable for such wafer scale chips. But again, no mention of what is used. I have read in the past that it would use Intel's 10nm, but this article mentions TSMC. Another article I read that they used a 16nm node ( https://fuse.wikichip.org/news/3010/a-look-at-cerebras-wafer... ), which as mentioned above about node maturity, understandable.