What's the deal with square traces on PCBs?
hackaday.com
hackaday.com
After the prototype revisions, it was very easy to move to 100% SMD and let the autorouter do its job ( design for manufacturing ).
It still is a huge time saver though!
I'm not sure how KiCad scales up to the $10k+ EDAs, but I am thoroughly amazed at it's quality and useability, especially considering that it's FOSS.
> https://store.steampowered.com/app/1098840/ZACHLIKE/
(hint: it is free (as beer) ;-) ).
But seriously, this type of any-angle/arc routing can be very effective and is often seen on IC interposer/package substrate routing.
The frequency scale spans 10..90 GHz.
The difference between square corners and compensated is real. And it gets more real if you're working in generic FR4 with 1.6mm thickness and 2-3mm wide traces for the sweet spot between 50 and 75 ohms.
> The final design that includes both the chamfered bend and the vias
But then I wonder about applications. If you ignore this rule of thumb, and gang a few hundred boards together sharing a clock... will your signal survive?
Sometimes a 'superstition' is just common sense regarding edge cases - walking under a ladder won't have cosmic effects, but a dropped bucket of paint can leave a mark
No. But then if you need a few hundred boards off a single clock I assume your phased array radar budget can handle the extra engineering.
PCB design/layout is one of the more important factors influencing EMC. Taking it into account early in the PCB design phase saves you a lot of trouble during certification.
I'm surprised about the hand-wavy way of ignoring a very well understood phenomenon.
One point the article left out is the risk of traces lifting off of the board. Having less sharp corners seems to reduce the risk of this happening with components that have a mechanical risk of coming off (like USB connectors, or large capacitors).
To be fair it's less likely to be an issue with more advanced etching processes, but there are still limits. The thicker the copper layer, the wider your minimum track and gap widths become, otherwise the copper traces are excessively undercut.
Someone needs to tell the semiconductor industry that, then, because all traces inside a modern IC are at 90 degrees. The whole chip is just a big array of parallel lines in two orientation that get cut by photolithography to form circuits. The vias between levels are 90 degrees too, of course.
It's certainly true that electromigration is going to concentrate more at tight bends. But in practice if it isn't killing your 7nm interconnect you're... probably going to be fine with that 1 mil trace that is a million times wider.
Maybe, just maybe, there's a high current, high voltage board out there with tiny traces that was designed with some kind of trivial electromigration mitigation. But if there is, I've never heard of it. And electromigration is absolutely not a reason to avoid 90 degree turns on your digital logic board, don't be ridiculous.
"Electromigration" is the motion of individual conductor nuclei out of the wire due to scattering with electron momentum. Effectively, when electrons are asked (by the electric field in the conductor) to make ultra-sharp turns at nanometer scales, they sometimes collide with the aluminum/copper/tungsten/whatever nucleus instead, knocking that nucleus away from where it should be in the crystal. Over time, this erodes the junction, increasing electrical resistance, and eventually the chip starts to fail at voltages and clock rates it used to handle well.
There are also fun things like optical proximity correction [1], but of course these things are mainly handled automatically by simulations/EDA tools now.
[1] https://en.wikipedia.org/wiki/Optical_proximity_correction
This occurs almost never in a modern VLSI process.
Practically every 90 degree turn in a modern process involves a via or a contact to a different layer--VLSI tends to run different layers in orthogonal directions from one another.
I actually suspect that the really advanced processes nowadays actually ban 90 degree turns in their design rules as it may make the phase shift masks impossible to compute.
The wording was loose, but I stand by the point: there are no interconnect technologies in the modern world that use anything but axis aligned conductors. All turns are 90 degrees. (It's just that to turn 90 degrees in the plane of the wafer you need to make two of them)
> The reason we don’t see square traces in most PCB designs is simply due to aesthetic convention. If it looks wrong, it is wrong. There is no specific reason why every circuit board design should shy away from 90-degree angles on traces, it’s just something that you shouldn’t do because it looks wrong.
Sure, you don't have to shy away from 90° but you also don't have to avoid it. I strongly disagree with "looks wrong". It's simply an aesthetic choice, there is no right or wrong about it.
I wonder if they did this kind of optimization back in the day when traces were hand-taped. The sensitivity is to rise time, not actually frequency, so even for the slower designs of the day, maybe 45° or arced corners were still useful?
Isn't that very common? Hell even the MSP430 is running at 25 MHz these days.
And for all the other reasons listed in the article, you should avoid sharp corners. It's lazy to do otherwise when mitred 45 degree bends or curves are so easy to generate in a CAD tool. It's the hardware version of a code smell - the board house (compiler) might not care, but it should be fixed - don't give up freely obtained manufacturing slack because you couldn't set up a trace bend rule.
I kind of feel like PCB layout ought to just be done by the antenna engineers for any serious product with wireless comms or high speed I/O.
(If anyone is looking for this btw the best option I found is Atmel's SAM ARM microcontrollers, e.g. as used in the Arduino Due.)
If you're using, for example, a fast logic family like LVC, fast edges on badly routed traces can radiate and interfere with other parts of the circuit, even if you're dealing with "low" clock rates or simple un-clocked logic.
adjective
having or forming one or more right angles or being at right angles to something
According to https://www.dictionary.com/browse/square, this is British usage, but I've often heard and used it in the US.This question has some answers: https://electronics.stackexchange.com/questions/74789/purpos...
Designers would say that none of those corners are right angled, and that they each have a bit of bevelling.
So to me this pcb is a rough draft, an unoptimized initial version. The optimization obviously wasn't worth any time (and I agree with that), but I think an EDA tool worth its price should take such a design and optimize it. Such details really aren't the job of a designer, but still have the potential to significantly improve a layout.
PCBs can come from PCBs, though.
It is a valid interpretation.
Electrons do bunch up on sharp corners, as far as high voltage design is concerned.
Sharp corners cause inductance when the current has to “turn the corner”. An infinitely sharp edge would have infinite inductance. Think of a charge having momentum, and the H field the result of that momentum. You can’t just change it.
This is more troublesome at RF due to the currents crowding at the edges of the line, where the path length is now different for inside and outside radius, irrespective of lumped discontinuities.
In the RF world we mitre the bends, and sometimes used swept bends. The swept bends supposedly radiate more than mitered, but have not proven that to myself.
The case where you do want sharp, 90 degree bends are on electrically small monopole type antennas. The inductance will compensate for the high capacitive reactance of the antenna.
What I was revering to in the above post is the susceptibility to breakdown and corona discharge from sharp edges (example at link below). I have done some static E field modeling in CST for HV breakdown in potted modules.
https://www.comsol.se/paper/modeling-of-avalanche-breakdown-...
But I really can't trust this very superficial attempt to prove a negative with regards to a very complex phenomenon that I do not think he understands, especially since he mentions nothing about inductance, reflections, or impedance changes.
Hell, RF experts with decades of experience will still find new corner-cases and issues with PCB layouts when it comes to analog signals.
In terms of "actual wisdom" regarding 90 degree traces: Some time ago at my job we had to actually scrap a PCB because of right-angle traces causing too much interference. The end effect was a comb filter on the signal and a ton of emitted RF interference.
TLDR: Yes, the phenomenon is real. Do not trust these hand-wavy attempts to dismiss it.
>a square of copper two millimeters on a side has the same resistance as a square of copper ten millimeters on a side. It’s counter-intuitive.
The phenomenon is perfectly intuitive for anyone who understands DC resistance of metals, and the geometric assumptions of the "sheet resistance" thought experiment.
Resistance is proportional to conducter length divided by cross-sectional area. For a sheet conductor, cross-sectional area is thickness times width. A necessary assumption, unstated in the article, is that the hypothetical test circuit somehow makes perfect, uniform electrical contact over the entirety of both of the sheet's chosen "width" edges.
Also, auto-routing exists so most people aren't handcrafting these corners.