Yes. Really, REALLY impractical.
"Disassemble phone, desolder security module, dissolve the outer layers in hydrochloric acid, cut the silicon into 16nm slices, scan each layer with an electron microscope" impractical.
"Disassemble phone, desolder security module, dissolve the outer layers in hydrochloric acid, cut the silicon into 16nm slices, scan each layer with an electron microscope" impractical.